Pulse laser peeling device - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

UV solid laser LLO device 'LSL-515-F/D'

Supports large substrates (515mm x 510mm)! Instant interface delamination is possible through laser irradiation.

This device uses a solid-state UV pulse laser to create a uniform line beam through our unique optical system, and it is designed to separate devices from substrates by moving the substrate on a stage. The separated substrates and devices are collected in a tray by a robotic arm. 【Features】 ■ Achieves a stable separation process with a uniform intensity line beam using a solid-state laser ■ No need for auxiliary equipment such as toxic gas, resulting in low cost and low running costs ■ Compatible with large substrates (515mm x 510mm) *For more details, please download the PDF or feel free to contact us.